Ethernet bonding aggregates multiple network interfaces into a single logical 'bonded' interface which increases the bandwidth and provides NIC redundancy. You can configure the bonding interfaces (bd0, bd1) with supported bonding modes and be able to add or remove ethernet interfaces (ether1, ether2 and so on).
Ethernet bonding module support is present in the base platform that consists of an independent MD module, cli module, and a bonding driver in the kernel. The base platform supports the following features in the bonding interface functionality with CLI only:
Able to create/remove the bond interface.
Able to add/remove the ethernet interfaces (ether1, ether2) to/from the bond.
Able to change the bonding mode, link monitoring time, down delay time, up delay time for the bonded interface.
Able to display bond information.
Note
For more information on bonding interface CLIs, see the CLI Command Reference document.
Configuring bond interfaces
Create a bond with the mode. Here, link-agg mode is configured.
Note
Mode is optional. By default, "backup" bond mode is assigned.
(config) # bond bd0 mode link-agg
Assign the IP address.
(config) # interface bd0 ip address 10.14.84.67 255.255.255.0
Add a bond interface to open ssh server port for ssh connection.
(config) # ssh server listen interface bd0
Add bond interface to open webserver port for web connection.
(config) # web server listen interface bd0
Add a slaves with the bond.
(config) # interface ether1 bond bd0 (config) # interface ether2 bond bd0
Display bonds.
(config) # show bonds Bonded Interface bd0: Enabled: yes Mode: link-agg Link Monitor Time: 100 Interfaces: ether1 ether2